Capabilities
A complete suite of custom VCSEL design and commercial laser and photonic software tools are used to engineer all of the laser and photonic solutions. A network of foundries are employed to provide state of the art high volume III-V manufacturing.
III-V epitaxial material growth
MOCVD and MBE
- Wavelengths from 650nm to >1000nm
- 150mm GaAs substrates
- Single and multi-junction VCSELs
- Metamorphic photodiodes
- 100mm InP substrates
Demonstrated device fabrication processes
Demonstrated device fabrication processes
- Single channel and 2D arrays
- Multilevel metal for addressability
- Au stud bumps for thermo-compression bonding
- Polarization control
- Photonic crystals
- Micro-Transfer Printing (MTP) compatibility
In-house engineering testing
- LIV over temperature (-55 to 125C)
- Small signal analysis to 40GHz
- Large Signal 28Gbps and 28GBd
- Near and far field measurements
- Polarization analysis
- Spectral characterization
- Relative Intensity Noise
- Optical Linewidth
Device fabrication processes in development
- Integrated top side and bottom side lenses
- CuSn solder bumps for flip chip mounting
Custom optical design and fabrication
- Injection molded Ultem
- On wafer optics
- Integrated optical sub-assemblies
Assembly and product test
- In-house die attach and wire bonding for prototype and small-scale production in non-hermetic TO and QFN style packages
- Customer specific alignment and test systems
Packaged VCSEL prototyping
- TO46 high speed components
- TO46 with ESD protection diode
- Multimode fiber coupled pigtails
- High power VCSELs in QFN surface mount
- Custom optical engines
Laser with integrated Electro-Absorption modulator (LEAM in development)
1310-1550m in development